Utilization of alternative wood particles for modern thermal insulation products – measurement data

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DATASET: Utilization of Alternative Wood Particles for Modern Thermal
Insulation Products - Raw Data
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1. GENERAL INFORMATION
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Associated publication:
Zach, J.; Peterková, J.; Novák, V.; Korjenic, A. (2024). Utilization
of alternative wood particles for modern thermal insulation products.
Journal of Physics: Conference Series, 2792, 012009.
DOI: https://doi.org/10.1088/1742-6596/2792/1/012009

Associated projects:
Study of the hygroaccumulative effect of natural based materials
and their influence on the moisture stability of the indoor
environment of buildings
Austrian Science Fund (FWF) [https://doi.org/10.55776/I6398]
Grant DOI: 10.55776/I6398 | Project number: I 6398-N
Czech Science Foundation | Project number: 23-06542K
Project 8J23AT012: Study of heat and moisture transport in the
structure of materials based on natural and secondary fibers

Dataset authors:

  Name                       Affiliation                       ORCID
  -------------------------  --------------------------------  --------------------
  Jiří Zach                  Brno University of Technology      0000-0002-0426-8317
  Jitka Peterková            Brno University of Technology      0000-0002-5545-4515
  Vítězslav Novák            Brno University of Technology      0000-0002-9204-5884
  Azra Korjenic              TU Wien                            0000-0002-2904-9532

Contact for questions about this dataset:
Jitka Peterková (Brno University of Technology): jitka.peterkova@vut.cz

License: CC BY 4.0 (Creative Commons Attribution 4.0 International)
https://creativecommons.org/licenses/by/4.0/

2. SHORT DESCRIPTION
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This dataset contains the measurement data of a study on secondary
wood raw materials (coarse root chips, wood shavings, wood flour; all
spruce wood) for thermal insulation products. The raw materials were
characterized (loose bulk density, sieve analysis), treated dry by
crushing, milling and separation into fractions, and evaluated as
loose-fill insulation (thermal conductivity at 23 degrees C / 50 % RH and
23 degrees C / 80 % RH). The wood flour fraction below 0.063 mm was
mixed with nanosilica (6 : 4) and 3 % viscose fibres and pressed into
core panels for vacuum insulation, whose thermal conductivity was
measured as a function of the gas pressure (1000 to 0.05 mBar) and of
the temperature (10 to 40 degrees C).

The dataset consists of the measured values behind Tables 1-6 and
Figure 4 of the publication; no further processing is needed.

3. METHODOLOGY (summary - see publication Sections 3-5 for full details)
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- Raw materials: loose bulk density, sieve analysis (sieves 16 to
  0.063 mm), microscopic analysis.

- Treatment (dry): crushing of the wood chips into a fine and a coarse
  fraction; milling of the shavings (crusher speed 6000 rpm, 10 / 30 /
  60 s) and separation of the shavings into the fractions 0-1, 0-2,
  1-2 and 2-16 mm. Evaluation by the loose bulk density.

- Loose-fill insulation: samples conditioned at 23 degrees C / 50 % RH and
  at 23 degrees C / 80 % RH; loose bulk density, moisture content and thermal
  conductivity (steady state, EN 12667 and ISO 8301, mean temperature
  10 degrees C, temperature difference 10 K, samples in a thermal insulation
  frame).

- Vacuum insulation: specific surface area of the wood flour fraction
  below 0.063 mm by the BET method; core panels (wood flour : SiO2 = 4 : 6,
  3 % viscose fibres, thickness 15 mm) pressed in steel moulds at 750 kPa;
  thermal conductivity with the FOX200 Vacuum device (EN 12667, ISO 8301)
  at pressures of 1000 to 0.05 mBar and mean temperatures of 10 to
  40 degrees C.

4. FILE DESCRIPTION
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Note: Due to repository constraints, all files are provided within
a single ZIP archive to preserve the folder
structure described below. The README itself is additionally
provided as a separate, unpacked file for quick reference.
A column-by-column description of all data files (names, meaning,
units) is given in metadata/data_dictionary.csv.

README.txt                             - this file
LICENSE.txt                            - full text of CC BY 4.0

metadata/
  conditioning_conditions.csv          - the two conditioning environments (23 degrees C / 50 % RH and 23 degrees C / 80 % RH)
  data_dictionary.csv                  - description and unit of every column of every data file
  equipment_list.csv                   - details of experimental hardware used
  materials_list.csv                   - raw materials and additives
  requirements.txt                     - software note (plain CSV files)
  standards_applied.txt                - overview of the standards applied or referenced

raw_data/
  raw_material_characterization/
    wood_loose_bulk_density_raw_materials.csv - loose bulk density of chips, shavings, wood flour (Table 1)
    wood_chips_ground_loose_bulk_density.csv  - loose bulk density of the fine and coarse ground chips (Section 3)
    wood_sieve_analysis.csv            - total passing per sieve size of the four materials (Table 2, Figure 4)
  wood_treatment/
    wood_shavings_milling.csv          - loose bulk density after milling for 10 / 30 / 60 s (Table 3)
    wood_shavings_separation.csv       - loose bulk density of the separated fractions (Table 3)
  thermal_insulation/
    loose_fill_thermal_insulation_properties.csv - loose bulk density, moisture content and thermal conductivity
                                         at 50 % and 80 % RH (Table 4)
  vacuum_insulation/
    wood_flour_specific_surface_area.csv      - BET surface area of the fraction below 0.063 mm (Section 5)
    vacuum_core_panel_properties.csv          - pressing pressure and average bulk density of the core panels (Section 5)
    vacuum_thermal_conductivity_pressure.csv  - thermal conductivity vs. gas pressure (Table 5)
    vacuum_thermal_conductivity_temperature.csv - thermal conductivity vs. temperature at 1000 and 0.05 mBar (Table 6)

processed_data/
  paper_tables_summary.csv             - all values of Tables 1-6 (and the text values) with the file each value is taken from

5. HOW TO CITE
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When reusing this dataset, please cite the associated publication:

  Zach, J. et al. (2024). Utilization of alternative wood particles
  for modern thermal insulation products. Journal of Physics:
  Conference Series, 2792, 012009.
  https://doi.org/10.1088/1742-6596/2792/1/012009

6. FUNDING ACKNOWLEDGEMENT
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This research was funded within a bilateral research project between
the Czech Republic and Austria: Czech Science Foundation (23-06542K)
and Austrian Science Fund (FWF) [https://doi.org/10.55776/I6398],
and by project 8J23AT012.

7. DATA TO PAPER MAPPING
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   Raw data (CSV in /raw_data/)                       Paper
   -------------------------------------------------  ------------------
   wood_loose_bulk_density_raw_materials.csv          Table 1
   wood_chips_ground_loose_bulk_density.csv           Section 3
   wood_sieve_analysis.csv                            Table 2, Figure 4
   wood_shavings_milling.csv, wood_shavings_separation.csv   Table 3
   loose_fill_thermal_insulation_properties.csv       Table 4
   wood_flour_specific_surface_area.csv, vacuum_core_panel_properties.csv   Section 5
   vacuum_thermal_conductivity_pressure.csv           Table 5
   vacuum_thermal_conductivity_temperature.csv        Table 6

   The values are the unrounded measured values; the publication
   prints them rounded. Figures 1, 3 and 5 are photographs, Figure 2
   shows microscopic photographs; they contain no further data.